> Car-Ele Japan 2018 | Bosch Semiconductors
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Bosch Semiconductors

Car-Ele Japan 2018

17 - 01/19/2018
Tokyo, Japan

From January 17 to 19, Asia's leading exhibition specialized in Automotive Electronics, takes place again at Tokyo Big Sight.

In East hall, Booth E53-48, Bosch will be presenting an attractive bundle of electronic solutions for mobility:

Electronic components for system vendors, IP modules for microcontroller makers and IoT solutions for car drivers.


This year's product highlights:

  • MEMS sensors for powertrain, active and passive safety systems
  • MEMS Mobility Sensors for none-safety relevant applications
  • Automotive System ICs for powertrain, airbag and ADAS.
  • GTM IP: A scalable I/O processor for automotive and industry μCs
  • Telematics eCall Plug & Bosch call center service for Japan


Attractions at the booth:

  • See the demonstrator “Safety in action” and find out what a vehicle’s sensors “see” while driving and what kind of information they provide to the airbag and ESP system.
  • The eCall station demonstrates how the Telenatics eCall plug TEP detects car crashes and how – in case of an accident - it automatically connects the driver to a call center for immediate help.


Meet us at the Bosch booth in East hall, E53-48.


Our sales and application team will be happy to answer your enquiries.