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Bosch Semiconductors for Automotive

Photolithography

The fact, that MEMS and ASIC products are manufactured partly in the same fab, allows access to the existing ASIC processes, like DUV lithography, phaseshift technology, etc. Therefore i-line and 248 nm KrF are used in mass production for MEMS.

Litho
Lithography narrow line

Features

  • Phase shift technology
  • CD down to 130nm line width
  • Organic and anorganic BARC
  • Various resist thickness up to 4µm in MEMS so far, higher possible
  • Frontside-backside alignment
  • Various photosensitive polyimides up to 12µm
  • Mask aligner mit IR alignment und backside alignment