Bosch starts construction of new 300mm Wafer Fab in Dresden
On April 24, 2018, Robert Bosch Semiconductor Manufacturing Dresden GmbH gave the official start signal for Bosch's new 300mm fab with a groundbreaking ceremony.
Representatives of the City of Dresden, construction partners, journalists and neighbors joined at the construction site to celebrate the official start of construction.
After speeches by Bosch management members and the mayor of Dresden, the groundbreaking ceremony took place.
The demand for semiconductors is expected to grow further, driven by electro-mobility and automated driving functions.
With the new Dresden plant, Bosch continues to play its active role in the European semiconductor network.
Highly automated production lines with fully connected data sources will enable efficient manufacturing processes, ensure reliable delivery and help to reach benchmark quality.