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300 mm semiconductor fab in Dresden
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Experts from the semiconductor industry, such as process, production, and maintenance engineers, mathematicians, software engineers, as well as professionals with degrees in physics, chemistry, and microsystems technologies.
The new one billion euros wafer fab in Dresden will manufacture 300 mm wafers. Following a rollout phase, pilot manufacturing operations are expected to start at the end of 2021. Up to 700 associates will be involved in the highly automated chip manufacturing process, working to plan, manage, and monitor production. After Reutlingen, the Dresden plant will be Bosch’s second wafer fab in Germany.