SiC power module portfolio 1,200 V

Bosch’s SiC power module on cooler PM6.1 is engineered for maximum power density in the smallest size. The versatile platform supports all performance variants, ensuring high reliability across applications. PM6.1 includes our 2nd generation SiC chips, that deliver significant improvements in conduction losses with enhanced RDS(on) performance compared to the first generation. The module also benefits from optimized diode switching behavior, resulting in reduced switching losses.

Our innovative Module AIT design incorporates a bond and solder-free AIT in the main current path, ensuring low AIT resistance and a robust sandwich structure with both bottom and top ceramic substrates. The AMB is directly soldered onto the cooler, providing low thermal resistance (Rth). PM6.1 uses a pressfit signal connection solution. It is compatible with standard gate drivers using common gate control.

With a CTE matched AIT concept, the PM6.1 achieves further enhanced reliability, allowing for higher temperature swings (dT) while maintaining high power density.