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SiC power module portfolio 1,200 V

SiC power module on cooler PM6.1

SiC power module on cooler PM6.1

Engineered for maximum power density in the smallest size

Bosch’s SiC power module on cooler PM6.1 is engineered for maximum power density in the smallest size. The versatile platform supports all performance variants, ensuring high reliability across applications. PM6.1 includes our 2nd generation SiC chips, that deliver significant improvements in conduction losses with enhanced RDS(on) performance compared to the first generation. The module also benefits from optimized diode switching behavior, resulting in reduced switching losses.

Our innovative Module AIT design incorporates a bond and solder-free AIT in the main current path, ensuring low AIT resistance and a robust sandwich structure with both bottom and top ceramic substrates. The AMB is directly soldered onto the cooler, providing low thermal resistance (Rth). PM6.1 uses a pressfit signal connection solution. It is compatible with standard gate drivers using common gate control.

With a CTE matched AIT concept, the PM6.1 achieves further enhanced reliability, allowing for higher temperature swings (dT) while maintaining high power density.

Benefits

Maximum power density in smallest size

B6 configuration

Closed aluminum cooler or open copper pinfin acc. to industry standard

Target applications

Inverters in (hybrid) electric vehicles

Technical features

PM6.1-1200-290-CW PM6.1-1200-340-CW PM6.1-1200-300-PW PM6.1-1200-350-PW
VDS
PM6.1-1200-290-CW
1,200 V
PM6.1-1200-340-CW
1,200 V
PM6.1-1200-300-PW
1,200 V
PM6.1-1200-350-PW
1,200 V
ID nom
PM6.1-1200-290-CW
290 A
PM6.1-1200-340-CW
340 A
PM6.1-1200-300-PW
300 A
PM6.1-1200-350-PW
350 A
Iph*
PM6.1-1200-290-CW
430 Arms
PM6.1-1200-340-CW
500 Arms
PM6.1-1200-300-PW
470 Arms
PM6.1-1200-350-PW
540 Arms
Cooler
PM6.1-1200-290-CW
closed Al Cooler
PM6.1-1200-340-CW
closed Al Cooler
PM6.1-1200-300-PW
Open Cu Pinfin
PM6.1-1200-350-PW
Open Cu Pinfin
Dimensions
PM6.1-1200-290-CW
~215 mm x 65 mm
PM6.1-1200-340-CW
~215 mm x 65 mm
PM6.1-1200-300-PW
~170 mm x 90 mm
PM6.1-1200-350-PW
~170 mm x 90 mm
Structure
PM6.1-1200-290-CW
Sandwich structure (bottom and top ceramic substrate) enables a bond & solder
free AIT in main current path
PM6.1-1200-340-CW
Sandwich structure (bottom and top ceramic substrate) enables a bond & solder
free AIT in main current path
PM6.1-1200-300-PW
Sandwich structure (bottom and top ceramic substrate) enables a bond & solder
free AIT in main current path
PM6.1-1200-350-PW
Sandwich structure (bottom and top ceramic substrate) enables a bond & solder
free AIT in main current path
Power contacts
PM6.1-1200-290-CW
direct welding on AMB
PM6.1-1200-340-CW
direct welding on AMB
PM6.1-1200-300-PW
direct welding on AMB
PM6.1-1200-350-PW
direct welding on AMB
Signal contacts
PM6.1-1200-290-CW
pressfit connection
PM6.1-1200-340-CW
pressfit connection
PM6.1-1200-300-PW
pressfit connection
PM6.1-1200-350-PW
pressfit connection