SiC power module portfolio 1,200 V
SiC power module on cooler PM6.1
Benefits
Maximum power density in smallest size
B6 configuration
Closed aluminum cooler or open copper pinfin acc. to industry standard
Target applications
Inverters in (hybrid) electric vehicles
Technical features
PM6.1-1200-290-CW | PM6.1-1200-340-CW | PM6.1-1200-300-PW | PM6.1-1200-350-PW | |
---|---|---|---|---|
VDS
|
PM6.1-1200-290-CW
1,200 V
|
PM6.1-1200-340-CW
1,200 V
|
PM6.1-1200-300-PW
1,200 V
|
PM6.1-1200-350-PW
1,200 V
|
ID nom
|
PM6.1-1200-290-CW
290 A
|
PM6.1-1200-340-CW
340 A
|
PM6.1-1200-300-PW
300 A
|
PM6.1-1200-350-PW
350 A
|
Iph*
|
PM6.1-1200-290-CW
430 Arms
|
PM6.1-1200-340-CW
500 Arms
|
PM6.1-1200-300-PW
470 Arms
|
PM6.1-1200-350-PW
540 Arms
|
Cooler
|
PM6.1-1200-290-CW
closed Al Cooler
|
PM6.1-1200-340-CW
closed Al Cooler
|
PM6.1-1200-300-PW
Open Cu Pinfin
|
PM6.1-1200-350-PW
Open Cu Pinfin
|
Dimensions
|
PM6.1-1200-290-CW
~215 mm x 65 mm
|
PM6.1-1200-340-CW
~215 mm x 65 mm
|
PM6.1-1200-300-PW
~170 mm x 90 mm
|
PM6.1-1200-350-PW
~170 mm x 90 mm
|
Structure
|
PM6.1-1200-290-CW
Sandwich structure (bottom and top ceramic substrate) enables a bond & solder
free AIT in main current path |
PM6.1-1200-340-CW
Sandwich structure (bottom and top ceramic substrate) enables a bond & solder
free AIT in main current path |
PM6.1-1200-300-PW
Sandwich structure (bottom and top ceramic substrate) enables a bond & solder
free AIT in main current path |
PM6.1-1200-350-PW
Sandwich structure (bottom and top ceramic substrate) enables a bond & solder
free AIT in main current path |
Power contacts
|
PM6.1-1200-290-CW
direct welding on AMB
|
PM6.1-1200-340-CW
direct welding on AMB
|
PM6.1-1200-300-PW
direct welding on AMB
|
PM6.1-1200-350-PW
direct welding on AMB
|
Signal contacts
|
PM6.1-1200-290-CW
pressfit connection
|
PM6.1-1200-340-CW
pressfit connection
|
PM6.1-1200-300-PW
pressfit connection
|
PM6.1-1200-350-PW
pressfit connection
|