APEC 2026
Experience the future of power electronics: Bosch at APEC 2026
The Applied Power Electronics Conference (APEC) is the premier event for power electronics professionals. We are excited to be back in 2026, showcasing our forward-thinking semiconductor solutions at booth 407.
Join us in San Antonio, Texas, and discover our latest innovations – from our comprehensive silicon carbide (SiC) portfolio to the high-performance gate driver families.
- Maximum performance with our comprehensive SiC power semiconductor portfolio
Discover the advantages of Bosch’s industry-leading SiC technology, engineered for the highest efficiency and power density. Our robust dual-channel SiC trench MOSFETs for 750V, 1,200 V and 1,700 V and our highly efficient power modules built on Bosch’s proprietary SiC technology are setting new standards for demanding EV applications.
- Get a sneak peek into the future: A preview of Bosch’s upcoming 3rd generation of SiC trench MOSFETS
We invite you to get an exclusive glimpse into the next evolution of SiC technology: the upcoming 3rd generation of our SiC trench MOSFETS. This next generation is being developed to push the boundaries of efficiency and power density even further.
- Optimized switching control and integrated protection for SiC and IGBTs: Bosch’s isolated HV gate driver portfolio
A powerful switch requires an equally powerful driver. Our gate driver portfolio is the perfect match for our SiC portfolio, offering maximum control and stable operation for your power switches.
We look forward to talking with you!
Plan your visit to our booth 407 at the Henry B. Gonzalez Convention Center. Our experts are ready to discuss your specific requirements and introduce you to the ideal solutions for your projects.


