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Bosch Semiconductors

MEMS foundry services

Customer specific MEMS devices

Bosch waferfab reutlingen, mems-foundry-services

Bosch MEMS Process Development and Manufacturing Service will accelerate customer specific MEMS development due to the availability of the probably broadest technology portfolio among MEMS suppliers. We offer our customers flexible R&D willingness and capabilities, a huge know-how in MEMS based on decades of experience, and finally a highly professional production capability with respect to quality, reliability, high volumes, steep ramp-ups and long-term delivery.







Largest technology portfolio selection

We probably offer the widest portfolio range worldwide among MEMS suppliers.

Technology Portfolio

Beside standard ASIC technologies, Bosch offers specific MEMS processes:
Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • KrF lithography for MEMS down to 130nm

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • All standard ASIC processes

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • Surface and Bulk micromachining

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • DRIE ("Bosch Process")

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • Vapor phase etch with HF for silicon oxide and XeF2 for Si

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • KOH etch

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • TSV in silicon or metal

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • Anti stiction and ALD coatings

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • PZT, AIN

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • Bonding: Anodic, glass frit, eutectic AIGe and epi seal

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • Gas or vacuum sealing, reseal

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • SiRiN

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • Porous silicon

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • Backside alignment and processing

Beside standard ASIC technologies, Bosch offers specific MEMS processes:

  • Grinding and polishing (especially bonded wafer pair)

Manufacturing capabilities

Frontend

  • 3 wafer fabs (150mm and 200mm)
  • More than 3,000 wafer starts per day
  • All fabs qualified for automotive and consumer:
    • IATF 16946
    • ISO 14001
    • and others

Backend

  • Wafer level test for 150mm and 200mm
  • Sensor assembly
  • Final test for packaged devices

Get in touch with us

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