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Bosch Semiconductors for Automotive

Bonding

Bosch offers different bond techniques to bond wafers and seal the enclosed space hermetically.

Eutectic Bonding
Eutectic Bonding

Available Wafer Bonding Technologies @ Bosch in series production:

  • Anodic Bonding
  • Eutectic Bonding (AlGe)
  • Glass Frit Bonding


In pre-development*:

  • Thermocompression Bonding
  • Direct Bonding


In-Line Characterization methods for bonded wafer stacks:

  • (IR-)Microscopy
  • Scanning Acoustic Microscopy (SAM)


Bonding capabilities
Bonding capabilities