Bonding
Bosch offers different bond techniques to bond wafers and seal the enclosed space hermetically.
Available Wafer Bonding Technologies @ Bosch in series production:
- Anodic Bonding
- Eutectic Bonding (AlGe)
- Glass Frit Bonding
In pre-development*:
- Thermocompression Bonding
- Direct Bonding
In-Line Characterization methods for bonded wafer stacks:
- (IR-)Microscopy
- Scanning Acoustic Microscopy (SAM)
