Skip to main content
Automotive semiconductors and sensors from Bosch

The Bosch wafer fab in Dresden

Wafer fab Dresden

Opened in 2021, the Bosch semiconductor factory Dresden manufactures key components for automotive and industrial applications. Production is centered on 300-millimeter wafer technology for automotive ICs, power semiconductors, and in the future MEMS sensors. The facility combines advanced manufacturing processes with a strategic location in Europe’s leading microelectronics cluster.

Key facts

Technology

Highly automated 300-mm silicon wafer production for structures down to 65 nm

Products

Automotive ICs, power semiconductors, and MEMS sensors (planned for 2027)

Applications

Components for mobility systems including airbag control units, brake and stability systems, engine and steering controls, as well as industrial electronics

Clean Room Area

13,000 m² / square meters

Location

Central in the Silicon Saxony microelectronics cluster

Processes

Vertically integrated development and manufacturing

Manufacturing Technology and Process Innovation

The Bosch semiconductor plant Dresden is equipped with Smart Fab manufacturing methods to ensure high product quality and process efficiency.

  • Connected Production: The plant’s systems are fully connected within a centralized data architecture. This allows for detailed data capture for each semiconductor chip, ensuring traceability and consistent quality control.
  • Artificial Intelligence (AI) in Manufacturing: AI optimizes manufacturing processes, product quality, and efficiency through data-based process control, real-time monitoring, and machine learning, leading to early deviation detection and higher manufacturing yields.
  • Digital Twin and 3D BIM: A Digital Twin of the plant, consisting of around half a million 3D objects, maps infrastructure and machines, allows for optimized planning, remote maintenance, and simulations of process changes. This leads to improved productivity, cost efficiency, and sustainability.
  • Regional Networking: The location benefits from the Silicon Saxony microelectronics cluster and its impulses for continuous progress.
Employee in cleanroom suit holding a large silicon wafer in a modern semiconductor manufacturing facility.
In Dresden, Bosch's focus is on 300-millimeter wafer technology for automotive ICs, power semiconductors, and, in the future, MEMS sensors.
A Bosch technician wearing a hard hat and high-visibility vest uses a tablet for maintenance or inspection of complex wiring and installations in an industrial facility.
A Digital Twin allows for optimized planning, remote maintenance, and simulations of process changes.
Three people discuss in front of large data screens in a modern office.
Fully connected systems within a centralized data architecture allow for close monitoring of each semiconductor chip.
/

Transitioning MEMS production to 300-mm wafers

Bosch is a leading supplier of MEMS sensors. At the Dresden site, we are advancing our manufacturing capabilities to produce these sensors on 300-mm wafers. This transition, a collaboration between our development, production, and equipment partners, is scheduled for mass production in 2027.

Production timeline:

  • July 2021: Series production for power initiated
  • September 2023: Series production of automotive ICs on 300-mm wafers initiated
  • 2027 (plan): Start of series production for MEMS on 300-mm wafers

Working at the Dresden semiconductor plant

The Dresden facility offers a modern, high-tech work environment within the framework of a global company. We cultivate an open, international work culture, employing a diverse team focused on microelectronics, IT, and engineering, where teamwork, innovation, and visibility are key to our operational success.

Our work environment:

  • Structure and Culture: We operate with team-oriented working groups and flat hierarchies that encourage open communication and personal exchange, fostering a dynamic environment which is critical for advanced manufacturing.
  • Talent Development and Global Network: Associates benefit from a flexible, trust-based work structure and access to diverse development and career opportunities across the global Bosch network, ensuring continuous skill advancement.
  • Integrated teams: The proximity of production and development teams for both automotive ICs and MEMS at the Dresden site allows for optimized manufacturing processes and accelerates the introduction of new technologies.
Discover our job offers
Become part of our team and shape the future with us. We offer you attractive opportunities for the next step in your career.
Want to get to know the team first?
Discover how we work and what defines us.

A strategic location in Silicon Saxony

Our Dresden plant benefits from its location within the “Silicon Saxony” microelectronics cluster. This ecosystem provides access to a network of suppliers, service providers, and application industries. We maintain active collaborations with local research institutes and are a strategic partner of the Technical University of Dresden, which helps us attract skilled workers and drive further innovation.