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Automotive semiconductors and sensors from Bosch
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SiC power MOSFETs | SiC discrete portfolio 1,200 V

Discrete SiC-Line (DSL)

SiC power MOSFETs | SiC discrete portfolio 1200 V

Designed for maximum scalability

Bosch’s Discrete SiC-Line (DSL), including our 2nd generation SiC chips, is designed for maximum scalability. These discretes offer great improvements in design to enable enhanced creepage distance & short circuit robustness.

Our DSL utilizes state-of-the-art substrate technology, including AMB (Si3N4) & Ag-sintered die attach, to deliver superior performance.

The package dimensions are designed for compatibility, featuring outlines with an exposed pad on the backside and power and signal connections that align with quasi-standard specifications:

Our signal connectors utilize a common-gate control for easy integration, thanks to selective solder pins with plating. Additionally, our power connectors feature improved welding terminals that reduce module stray inductance and support higher currents.

Benefits

B1 solution using Bosch’s 2nd generation SiC chips

Special design features enable enhanced creepage distance & short circuit robustness

Drop-in replacement possible

Target applications

Inverters in (hybrid) electric vehicles

Technical features

BT2M12004R8TPA BT2M12006R0TPA BT2M12006R7TPA
VDS
BT2M12004R8TPA
1200 V
BT2M12006R0TPA
1200 V
BT2M12006R7TPA
1200 V
ID max
BT2M12004R8TPA
310 A
BT2M12006R0TPA
260 A
BT2M12006R7TPA
245 A
RDS(on) @ 50% IDS max
BT2M12004R8TPA
4.8
BT2M12006R0TPA
6.0
BT2M12006R7TPA
6.7