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Automotive semiconductors and sensors from Bosch
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SiC power MOSFETs | SiC discrete portfolio 750 V

QDPAK (Top side cooled)

QDPAK

Designed for maximum scalability

Bosch’s QDPAK is a top side cooled (TSC) package designed for high-power discrete products in automotive applications. Engineered for performance and space efficiency, it offers:

  • Compact footprint: 15 mm x 21.6 mm (≈314 mm²)
  • JEDEC-compliant design: Ensures compatibility and reliability
  • High power density: Enables advanced functions like bi-directional switching
  • Enhanced cooling: Reduces system costs and improves efficiency
  • Space-saving layout: Minimizes PCB requirements for additional cost benefits

Ideal for modern automotive electronics, our QDPAK combines robust thermal management with optimized size, delivering superior performance in demanding environments.

Benefits

SMD with improved cooling possibility

Bosch dual channel trench gate technology for lower RDS(on) × A

Switching speed adjustable with gate resistors

Target applications

On-board chargers, DC/DC converters and inverters in (hybrid) electric vehicles

Technical features QDPAK (Top side cooled) – 2nd generation

BT2M0750006Q2A BT2M0750013Q2A BT2M0750028Q2A
VDS
BT2M0750006Q2A
750 V
BT2M0750013Q2A
750 V
BT2M0750028Q2A
750 V
ID max
BT2M0750006Q2A
200 A
BT2M0750013Q2A
96 A
BT2M0750028Q2A
48 A
RDS(on) @ 50% IDS max
BT2M0750006Q2A
6 mΩ
BT2M0750013Q2A
13 mΩ
BT2M0750028Q2A
28 mΩ
Status
BT2M0750006Q2A
In development
BT2M0750013Q2A
In development
BT2M0750028Q2A
In development
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Silicon carbide (SiC) power semiconductors from Bosch – SiC discretes

Bosch offers a comprehensive portfolio of silicon carbide (SiC) power semiconductors tailored meet the demanding needs of high-power applications. Our range includes bare dies, discretes, and power modules, guaranteeing the ideal solution for any application.

For packaged solutions, our SiC discretes are ideal for applications including on-board chargers, DC/DC converters, and inverters. These packaged versions ensure reliable performance and ease of integration into various power electronics system