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Bosch semiconductors for Automotive

New microelectronics for the driving experience of the future

Semiconductor manufacturing

CAN SIC XL Transceiver for the network requirements of tomorrow's vehicles

CAN networks continue to be popular due to their robustness, cost efficiency, simplicity and flexibility in terms of network topologies. At the same time, the fast transmission of large data sets is becoming increasingly important in new E/E architectures. The downward-compatible extension of the CAN standard, the CAN XL protocol (ISO 11898-1:2024) now enables data transmission rates of up to 20 Mbit/s in CAN networks.

The newly developed CAN SIC XL Transceiver NT156 allows the operation of CAN XL networks at maximum speed of up to 20 Mbit/s. In addition to the familiar CAN messages, the CAN XL protocol also enables the use of higher layer protocols such as IP (Internet Protocol).

CAN SIC XL Transceiver NT156
CAN SIC XL Transceiver NT156 enables data transmission rates of up to 20 Mbit/s in CAN XL networks.

Powerful microelectronics for automated driving: radar SoCs with integrated data processing

Single-Chip-Radar-SoC for 77 GHz-radar systems SX600/SX601
SX600 and SX601 radar system-on-chip (SoC) with integrated data processing

The reliable detection of obstacles via radar sensors is an important safety aspect of modern and increasingly autonomous driving. With the SX600 and the SX601, Bosch offers radar system-on-chip (SoC) solutions operating in the 77 GHz band. While the SX600 has been optimized as a cost-effective radar solution, the SX601 offers increased computing power and memory. Both chips are manufactured using advanced 22nm RFCMOS technology, contain a complete millimeter-wave sensing frontend as well as a powerful digital signal processor for conventional or AI-based data processing and enable sensor ranges of around 30 percent above the current market standard. CAN XL and Ethernet interfaces provide flexible connections to the vehicle system.

BLE 5.3-capable MEMS sensor module for tire pressure monitoring

More measurement data, more safety - less complexity: The SMP290 is a fully integrated, Bluetooth-enabled single-chip solution for tire pressure monitoring systems (TPMS). The compact sensor module contains the wireless interface, a microcontroller, a MEMS pressure sensor, a 2-axis MEMS acceleration sensor, a temperature sensor and a battery voltage sensor. Diagnostics and communication are possible in both directions via the standardized BLE5.3 interface, and the transmission of measurement data or updates is encrypted. The BLE standard is already used in other vehicle components such as infotainment and remote keys. This means that the sensor module fits perfectly into the vehicle's wireless landscape. The SMP290 is suitable for tire pressure monitoring via the valve or in the tire.

Tire pressure sensor module with Bluetooth interface SMP290
The SMP290 tire pressure sensor is suitable for tire pressure monitoring via the valve or integrated in the tire.

All new products were showcased at electronica 2024 (Munich, November 12 to 15)

NT156 demo
Premiere: New CAN SIC XL Transceiver NT156: Transmitting an ethernet stream via CAN XL
Radar demo
Visitors got the chance to experience the radar SoC SX601 live, where it detected and processed their gestures using an AI application running directly on the chip.
SMP 290 demo
All-in-one solution: MEMS tire pressure sensor module with Bluetooth Low Energy interface enables simplified E/E architecture.
Next generation MEMS demo
The latest MEMS sensor solutions for driver assistance systems, as well as for driving safety and comfort.
SiC demo desk
Bosch’s second generation of SiC MOSFETs offers optimized switching characteristics and very low on-resistance across the entire temperature range. Bosch sells its silicon carbide chips as bare dies, as discretes, and integrated in power modules.
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