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The Bosch wafer fab in Reutlingen is the company’s most established and experienced semiconductor manufacturing site. With more than 60 years of semiconductor know how, Reutlingen has played a decisive role in shaping Bosch’s global semiconductor leadership – from its early work in automotive ICs to pioneering MEMS manufacturing and the advancement of silicon carbide (SiC) power devices for the automotive industry.
Semiconductor production at the site began in 1970, followed by 150 mm wafer manufacturing in 1995 and 200 mm wafer production in 2010. Today, the fab produces Automotive ICs, MEMS sensors, and power semiconductors, including SiC MOSFETs and offers MEMS foundry services based on its long-standing MEMS experience.
As the only semiconductor location worldwide, that combines frontend and backend manufacturing, including its own test center, Reutlingen offers exceptionally close collaboration between development, production, and test engineering, creating an environment that is both rare in the semiconductor industry and highly attractive for engineers.
With its transformation into a fully 200 mm fab now complete, the site significantly boosts Bosch’s capacity to manufacture semiconductors for the mobility of the future.
Highly automated 200-mm silicon and silicon carbide (SiC) production for structures down to 180 nm
Automotive ICs, low-voltage/high-voltage power semiconductors, and MEMS sensors as well as MEMS foundry services
Electromobility and key automotive electronics systems including airbag, driver assistance systems and Electronic Stability Control (ESC) as well as c onsumer electronics including games consoles, hearables, laptops, smartphones and wearables
44,000 m² / square meters
Reutlingen, south of Stuttgart
The production includes both frontend and backend processes
Reutlingen’s semiconductor journey began in 1970 and has evolved into a center of excellence for Bosch’s microelectronics. The close integration of production and development enables fast industrialization of new technologies and continuous optimization of both processes and products.
The site’s long legacy includes:
This deep experience forms the foundation for Bosch’s Automotive IC, MEMS and SiC technology leadership.
Reutlingen stands at the heart of Bosch’s most significant semiconductor innovations. The site established Bosch’s early expertise in automotive ICs, enabled the large scale industrialization of MEMS sensors, and continues to play a central role in advancing SiC power semiconductor technology.
Bosch consolidated its semiconductor development and production in Reutlingen in the late 1960s, responding to the rising demand for automotive electronics. Large scale IC manufacturing began in 1970, establishing Reutlingen as a central hub for Automotive IC development and production and providing key components for the growing number of automotive control units.
Reutlingen played a decisive role in bringing MEMS technology into mass production. Following the invention of the Deep Reactive Ion Etching (DRIE) process, commonly known as the “Bosch Process” in 1994, Bosch ramped up large scale MEMS manufacturing at the Reutlingen site in 1995. This marked the starting point for Bosch becoming one of the world’s leading suppliers of MEMS sensors for automotive and consumer electronics. Today, Bosch develops and manufactures all its MEMS sensors in‑house at its sites in Reutlingen and Dresden, Germany.
Bosch has been developing SiC semiconductors since 2001 and introduced its first prototype MOSFET in 2011. Building on process know how rooted in the “Bosch Process”, the company was the first to bring SiC trench MOSFETs into automotive series production. Reutlingen has been mass producing SiC chips on 150 mm wafers since 2021 and has now completed its transformation into a pure 200 mm fab, enabling higher output, improved economies of scale, and enhanced performance for future mobility applications.
Reutlingen combines decades of engineering expertise with highly automated, AI assisted manufacturing systems. Continuous process optimization, advanced equipment, and close collaboration between production and development ensure consistently high quality and rapid industrialization of new semiconductor technologies.
The site’s process engineers and manufacturing experts work together to enhance yield, reliability, and throughput, ensuring that each technology meets Bosch’s stringent automotive-grade standards.
The Reutlingen semiconductor plant offers an inspiring environment for people who want to work at the forefront of microelectronics. As Bosch’s headquarters for Mobility Electronics, the site brings together experts from semiconductor development, manufacturing and administration in a dynamic, international setting.