electronica Munich 2026

Join Bosch at electronica Munich 2026, the world’s leading trade fair and conference for electronics. From November 10 to 13 2026, visit our booth in Munich to explore how our advanced semiconductor and sensor solutions are driving innovation. Discover our latest product news and discuss your specific challenges with our experts.

Experience how Bosch is advancing the technologies that power the next generation of mobility. From industry-leading MEMS sensors and automotive ICs to high-performance silicon carbide (SiC) power semiconductors, explore solutions that help make mobility safer, smarter, more connected and efficient.

• The new benchmark for vehicle motion sensing: Bosch will launch its SMI340 MEMS sensor combining ADAS and safety applications up to ASIL D in a single sensor platform.
• Real-time tire insights for smarter mobility : Our power-efficient tire pressure monitoring sensor SMP290 with Bluetooth Low Energy (BLE) interface provides an ideal platform for advanced in-tire sensing solutions.
• Bosch’s MEMS sensors form the foundation of intelligent, responsive systems: Explore innovative technologies such as the SMA270, a high-performance acceleration sensor for inclination detection and headlight leveling. Together with our broader MEMS portfolio, these solutions enable safer, smarter, and more connected applications across automotive and emerging growth markets.
• Setting new benchmarks with our 3^rd generation SiC MOSFETs: Experience the latest milestone in our SiC roadmap. Learn how our 3^rd generation SiC trench MOSFETs enables superior switching performance and helps you achieve new levels of power density.
• Unlocking new levels of efficiency with our comprehensive SiC power semiconductor portfolio: Explore our portfolio of SiC MOSFETs and power modules built on Bosch’s proprietary SiC technology. Engineered for maximum efficiency and reliability, our robust dual-channel SiC trench MOSFETs for 750V, 1,200 V and 1,700 V and our highly efficient SiC power modules help you get the most out of your system designs, especially in demanding environments such as e-mobility.
• Empower the next generation of safe, connected, and software-defined vehicles with automotive ICs from Bosch: Experience ICs for assisted and automated driving, functional safety, vehicle networking, and advanced motion control. From ultrasonic sensor ICs and airbag electronics to CAN XL connectivity and integrated motor-control solutions, our automotive IC portfolio enables the next generation of intelligent, safe, and software-defined vehicles.

Semiconductors and sensors are at the heart of modern vehicles. From safety and motion sensing to connectivity and electrification, Bosch technologies enable many of the functions drivers rely on every day. By 2035, Bosch expects an average of more than 40 Bosch chips to be integrated into every new vehicle. Today, vehicles already contain around 20 MEMS sensors on average, with every third sensor coming from Bosch.

We look forward to talking with you!
Plan your visit to our Booth 316 in HallC3. Our experts are ready to discuss your specific requirements and identify the right solutions for your projects.