Bonding
Bosch offers different bond techniques to bond wafers and seal the enclosed space hermetically.
![Eutectic Bonding](/media/mems_foundry_services/bonden_eutektisch_res_800x450.jpg, /media/mems_foundry_services/bonden_eutektisch_res_1600x900.jpg 2x)
Available Wafer Bonding Technologies @ Bosch in series production:
- Anodic Bonding
- Eutectic Bonding (AlGe)
- Glass Frit Bonding
In pre-development*:
- Thermocompression Bonding
- Direct Bonding
In-Line Characterization methods for bonded wafer stacks:
- (IR-)Microscopy
- Scanning Acoustic Microscopy (SAM)
![Bonding capabilities](/media/mems_foundry_services/bonding_res_800x450.jpg, /media/mems_foundry_services/bonding_res_800x450.jpg 2x)