”MEMS sensors are the key technology for a mobile and connected world.”

As a Technical Project Lead for first-level packaging of MEMS sensors, it is my responsibility to drive the development of housing concepts that protect some of the most sensitive components in modern electronics. My work begins with the first design concepts and continues until the package is ready for high-volume manufacturing.

Developing MEMS sensors starts long before a device reaches a vehicle or consumer product. At the heart of this process lies a discipline where microns matter and packaging defines performance. In first level packaging, multiple silicon chips such as MEMS elements and ASICs are combined into a single unit. I develop tailored concepts for this assembly, define materials, and ensure that bonding wires, which are even thinner than a human hair, reliably connect each component.

My day-to-day work is very varied. It involves a mix of laboratory and office work, as well as coordination with our semiconductor packaging suppliers, for example in China or Korea. I accompany the ramp-up of series production at their facilities and make sure that all technical specifications from Bosch are met.

My tasks also include close coordination with the manufacturers of the various materials used for the housings and with the suppliers of the equipment used in the production lines of our packaging suppliers.

As MEMS reacts to the slightest mechanical stress, every adhesive, substrate, and molding step must be individually engineered. For each product, the materials, such as adhesives and circuit boards, as well as the manufacturing processes must be carefully and individually selected. I lead the development process in collaboration with our semiconductor packaging suppliers, who then manufacture the housings in large quantities. In my role as Senior Expert Molding Technology, I also support various projects with specific questions regarding plastic molding, since the packages are ultimately molded with plastic. My task is completed once series production begins and the packages are handed over to my colleagues in production.

The role of Technical Project Lead is crucial in first-level packaging, as semiconductor chips cannot be used at all without a housing. Although choosing the “right packaging” may seem trivial at first glance, especially with MEMS sensors, the housing is often a key factor in the sensor’s functionality and subsequent application in the product. MEMS sensors from Bosch are used in a wide range of applications, both in the automotive and consumer sectors, from trucks to headphones.

Absolutely. And it’s a job that makes a difference. MEMS sensors are indispensable in vehicles and electronic devices today, making them one of Bosch’s fastest-growing business segments. That’s why we are developing packaging technologies and concepts for tomorrow’s MEMS sensors. Our goal is to enhance a wide range of everyday objects through sensor technology with context awareness and situation-appropriate intelligence. In a nutshell: We deliver technology “invented for life”.

What roles do MEMS sensors play in modern vehicles?

Bosch automotive MEMS sensors cover a broad range of functions. They register motion, pressure, humidity, flow, sound, gases, and magnetic fields depending on their purpose in the vehicle. These compact components deliver highly accurate, sensitive measurements while requiring only minimal installation space. Their low energy demand also supports efficient operation across numerous automotive systems.

How do Bosch automotive MEMS sensors enhance vehicle safety?

MEMS technology is a foundational element in many safety relevant systems, including airbags, stability control, driver assistance features, and automated driving functions. Bosch provides MEMS sensors designed specifically for these critical applications, which are engineered to comply with the highest automotive safety integrity level (ASIL D) and ensure maximum reliability for vehicle electronics.