This was CES Las Vegas 2026

At CES, visitors could explore how Bosch is using its silicon carbide trench expertise to realize advanced SiC trench generations. Our robust SiC MOSFETs for 1,200 V and 750 V enable significant performance improvements in EVs. Not only do they increase power density, but they also lead to better reliability over the vehicle’s lifetime. Our scalable, highly efficient power modules, which are also based on silicon carbide technology from Bosch, attracted a lot of attention.

For especially curious visitors, we revealed our current efforts to further improve SiC trench architecture with a glimpse of the 3rd generation of SiC MOSFETs. One question that our experts at the booth were frequently asked was: “what is the current status of your production?” We were happy to report that we have been producing samples of the first generation 2 SiC chips on 200 mm wafers in Reutlingen, Germany since June 2024 for customer trials and we are currently preparing to ramp up series production of generation 2 on 200 mm in Reutlingen as well as in Roseville, California.

Our Tech Room offered an even deeper dive into the future of mobility with our latest automotive MEMS innovations. The SMU300, our high-performance inertial sensor, provides precise localization for autonomous driving, featuring low noise, “close-to-zero” temperature drift and durable ceramic packaging.

For increased driving comfort, the new SMA380, a high-bandwidth acceleration sensor, detects and processes vibrations from road noise with low latency. Of course, visitors could also have a closer look at Bosch’s SMP290 tire pressure sensor with integrated Bluetooth Low Energy (BLE) interface, which enables new integration concepts and smartphone interaction.

Another big topic in our Tech Room were integrated circuits for AI-supported vehicle applications. Retaining the full range of sensor data offers an advantage when it is being used in AI-based functions. This is where the new ultrasonic sensor IC chipset comes in: the TB293 and TB193 chips record the signal directly at the transducer, allowing much better object detection. The new Bosch system-on-chip (SoC) product family combines the most important components for radar SoCs and offers an exceptionally high resolution and long range. The high computing power of the SX601 supports machine-learning applications for advanced object recognition.

Fast data transfer was also a Tech Room highlight. Future vehicle platforms in modern E/E architectures have significantly higher bandwidth needs, which is why the CAN SIC XL transceiver enables data rates of up to 20 Mbit/s. Additionally to its advanced performance, it allows for the integration of IP-based protocols alongside classic CAN communication for increased flexibility.

Finally, we showcased am emerging technology that will play a defining role in enabling software-defined mobility. The Automotive Chiplet System (ACS) demonstrator highlights the benefits of chiplet integration for scalability and flexibility. By bringing modular building blocks such as automotive base die (ABD), artificial intelligence (AI) or infotainment (IVI) dies into a single integrated package, chiplets represent a strategic leap in semiconductor design. Unlike traditional monolithic SoCs, chiplets allow flexible, scalable, and cost-efficient compute platforms that can be tailored to a broad range of automotive needs.

Did you miss this year’s CES? Don’t worry! Not all that happens in Las Vegas stays in Las Vegas. Stay tuned and join us at one of the upcoming events in 2026!