Ultrasonic chipsets empower the next generation of AI based parking assistance

Ultrasonic sensors have been a trusted technology for parking assistance for decades. Until now, however, much of the original sensor information was processed early and filtered before reaching the central processing unit. While efficient, this approach limited the depth of information available for advanced algorithms.

Bosch’s new ultrasonic chipsets take a different route. By transmitting unprocessed raw data from the sensor to the vehicle’s central systems, they unlock a far higher level of detail. AI‑based parking assistants gain a more precise understanding of obstacles such as vehicles, curbs, pillars, or walls – even in challenging environments like narrow parking garages or densely packed urban spaces.

Beyond object detection, the raw signals also reveal subtle characteristics of the environment. Road surfaces, moisture, or varying ground conditions can now be assessed more reliably, opening the door to additional features such as more context‑aware braking decisions and enhanced maneuvering strategies.

At the heart of this innovation is a dual‑chip architecture designed for modern vehicle electronics. As the sensor chip, TB293 is installed directly at the ultrasonic transducer and captures the original echo signals without intermediate processing steps. TB193, in turn, is the controller chip: Positioned centrally, it coordinates multiple sensor chips, processes the incoming data, and prepares it for further analysis by advanced driver assistance systems.

Together, the chipsets deliver exactly the information AI‑powered parking and braking assistants need – with no loss of relevant detail between sensor and processor.

This architecture aligns perfectly with the shift toward centralized and software‑defined vehicle platforms. It enables scalable system designs, reduces complexity at vehicle level, and allows manufacturers to flexibly adapt the number of sensors to different vehicle classes and feature sets.

Raw data only becomes valuable when it can be transmitted and processed without delay. With a data rate of up to 1.16 Mbps, Bosch’s ultrasonic chipsets ensure real‑time transmission of large data volumes. This uniquely high bandwidth is the foundation for advanced assistance functions that depend on rapid and reliable information flow – ensuring that no critical detail is lost on its way from the sensor to the central computing unit.

The availability of raw ultrasonic data also enables high‑quality sensor fusion. When combined with camera and radar signals, AI algorithms can draw more differentiated conclusions and create a more comprehensive, robust view of the vehicle’s surroundings.

In addition to performance and flexibility, the new chipsets are designed with efficiency and robustness in mind. Compared to similar solutions, the chipsets consume up to 50 percent less energy, preserving battery power in situations such as start‑stop operation or electric driving modes in hybrid vehicles. Fewer peripheral components and a reduced pin count further simplify system design. Also the cabling effort is reduced through the introduction of the VASI (Versatile Automotive Sensor Interface) bus, an open interface that transmits both data and power over a single connection. This can cut component weight by up to 50 percent – a meaningful contribution to overall vehicle efficiency. The chipsets are further built to withstand demanding automotive environments, with a temperature rating of up to 150°C, enabling reliable operation even in engine‑adjacent installation areas.

Bosch’s seventh generation of ultrasonic chips represents more than an incremental technology update. It marks a strategic milestone on the path toward higher levels of automation. By combining complete raw data availability, high transmission speed, energy efficiency, and an open interface, the TB193 and TB293 chipsets provide vehicle manufacturers with a future‑proof foundation. Assistance systems developed today can seamlessly evolve into more advanced, highly automated driving functions tomorrow. In doing so, Bosch once again demonstrates how intelligent semiconductor solutions can turn complex technological challenges into tangible benefits – making mobility safer, smarter, and more comfortable.