Auto China 2026

• Setting new benchmarks with our 3rd generation SiC MOSFETs: Experience the next breakthrough in our SiC technology journey. Discover how our 3rd generation SiC trench MOSFETs deliver outstanding switching performance- empowering you to reach unprecedented levels of power density in your designs.
• SiC power semiconductors: Explore the newest generations of our dual-channel SiC trench MOSFETs for 1,700V, 1,200 V and 750 V, along with highly efficient power modules built on Bosch’s proprietary SiC technology.
• Optimized Switching Control & Built-In Protection: Unlock extended driving range through highly efficient switching, benefit from flexible hybrid control of SiC and IGBT technologies and simplify your overall system design—all with our SiC MOSFET Gate Drivers.

Latest MEMS sensor solutions: Discover how our advanced MEMS technologies elevate ADAS performance, enable road noise cancellation, enhance comfort features, and deliver precise vibration monitoring across next generation mobility applications.

• Ultrasonic sensor IC chipset: powerful microelectronics for assisted and automated driving.

Next GEN MEMS sensors: Explore our MEMS sensors enabling accurate deceleration sensing for airbag controllers, high precision inertial data for vehicle dynamics control, and robust pressure sensing for TPMS safety functions.

• Powerful Automotive ICs: Experience a sophisticated safety concept paired with extensive diagnostic capabilities from our airbag system IC family - enhanced by our reliable H‑Bridge driver IC for Automated Parking Brake applications, designed to support all modern braking control units with confidence and precision.

• CAN SIC XL Transceiver: Designed to support the networking needs of tomorrow’s vehicles.
• Fully integrated 48V motor control solution IC, combining high performance, automotive-grade reliability, safety (ASIL-B), and cybersecurity, while reducing BOM, PCB space, and time-to-market for BLDC applications in next-generation E/E architectures.