Electronica India 2026

The future of mobility is becoming increasingly electric, connected, and intelligent.

India is rapidly emerging as a key market for electric mobility, automotive electronics, and semiconductor innovation. As the industry moves toward electrification, software-defined vehicles, ADAS, and intelligent manufacturing, semiconductors are becoming the foundation of future mobility.

Join Bosch at Electronica India 2026 to explore our latest innovations in SiC power semiconductors, MEMS sensors, automotive ICs, and IP modules, enabling more efficient, comfortable, and safer mobility.

MEMS sensors from Bosch enabling safer, smarter, and more comfortable mobility.

Designed for ADAS, vehicle dynamics control, TPMS, airbag systems, road noise cancellation, active suspension and vibration monitoring, our sensors deliver exceptional precision, reliability, and robustness. High-accuracy inertial, deceleration, and pressure sensing technologies enhance vehicle safety, driving comfort, and intelligent performance.

Automotive IC's from Bosch power the next generation of ADAS, automated driving, smart parking, vehicle safety, and braking systems. Our portfolio includes the Radar SoC, Ultrasonic Sensor Chipsets, advanced airbag ICs, and Automated Parking Brake ICs.

Complementing this is Bosch’s fully integrated 48V motor control IC, combining high performance, ASIL-B functional safety, and cybersecurity while reducing BOM, PCB footprint, and time-to-market for BLDC applications in next-generation vehicle architectures.

As vehicle E/E architectures becomes increasingly data-driven, advanced communication and control solutions are essential. Bosch addresses these challenges with CAN XL and the NT156 CAN SIC XL transceiver, enabling higher bandwidth, improved network performance, and a future-ready foundation for software-defined vehicles.

Experience live demonstrations of intelligent object detection, smart parking assistance, assisted driving, and advanced vehicle safety functions.

Experience the next generation of SiC technology with our 3rd-generation SiC trench MOSFETs, delivering outstanding switching performance, efficiency, and power density for electric mobility applications. Our portfolio includes 750 V, 1,200 V, and 1,700 V dual-channel SiC trench MOSFETs and highly efficient power modules for traction inverters, on-board chargers, DC-DC converters, EV powertrains, and high-voltage power electronics.

Combined with SiC MOSFET Gate Drivers from Bosch, these solutions provide optimized switching control, integrated protection, hybrid SiC/IGBT support, simplified system design, and enhanced energy efficiency.