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Automotive semiconductors and sensors from Bosch

ASIC development

What is ASIC development?

ASIC development is the process of designing and manufacturing application-specific integrated circuits on semiconductor processes tailored to particular functions or systems. ASICs are created to meet specific performance, power, or integration requirements that cannot be adequately addressed by off-the-shelf components. The development process encompasses specification definition, architecture, circuit design, verification, semiconductor fabrication and testing phases to deliver a customized silicon solution.

Where are ASICs used in automotive applications?

ASICs serve critical functions in automotive systems where standard components cannot meet specific integration, performance, or differentiation requirements. Key applications include:

  • Engine control ASICs for pressure control, injection control, engine management. whiper control and engine supplies
  • Motion control ASICs for braking applications, steering applications, aoccupant safty application like airbag systems
  • Advanced driver assistance systems for radar systems, ultra sonic parking, power management and computation
  • Electrification ASICs possible as low and high voltage applications like Inverters, Interfacing devices, electrical motor control and 48V applications
  • IP ASICs integrating multiple communication protocols and interfaces

ASIC development becomes relevant when existing standard products lack the required feature combination, performance characteristics, or when system-level differentiation depends on custom silicon functionality to gain a system or cost benefit.

How do ASICs compare to ASSPs?

The primary distinction between ASICs and Application-Specific Standard Products (ASSPs) lies in customization scope and development approach. ASICs are developed specifically for individual customers or applications, while ASSPs target broader market segments with standardized functionality and plattform building blocks.

Attribute ASIC ASSP
Attribute
Customization
ASIC
Full hardware and software customization
ASSP
Fixed functionality with configuration options
Attribute
Development effort
ASIC
Requires complete design cycle
ASSP
Integration and validation only
Attribute
Time-to-market
ASIC
Longer due to custom design phases
ASSP
Shorter with immediate availability
Attribute
Differentiation potential
ASIC
Maximum system-level differentiation
ASSP
Limited to software and system integration

ASICs provide complete control over circuit implementation, enabling optimization for specific use cases, while ASSPs offer faster descrete deployment with predetermined feature sets. The choice depends on differentiation requirements versus development timeline constraints for system optimizations.

How is Bosch positioned in ASIC development?

Bosch operates semiconductor fabs and provides custom IC development services, particularly for automotive applications. The company develops ASICs for sensor systems and control units, leveraging expertise in MEMS technology and power semiconductor manufacturing. Bosch’s ASIC capabilities are on a full design cycle for analog, mixed-signal, digital and SoC designs with focus areas including sensor interface circuits, power management, and automotive-qualified processing units. The company’s dual role as both automotive system supplier and semiconductor manufacturer enables integration of custom silicon solutions across its product portfolio.

Frequently Asked Questions

What does ASIC development involve?

ASIC development encompasses the complete process from initial specification through production-ready silicon. It includes requirements analysis, architecture definition, circuit design, layout implementation, verification, prototype fabrication, testing, and production qualification.

What are the main phases in ASIC development?

The development follows distinct phases: specification and architecture definition, RTL design and circuit implementation, functional and physical verification, tape-out for fabrication, and comprehensive testing including production qualification. Each phase includes validation checkpoints before proceeding to the next stage.

What are typical cost blocks in ASIC projects?

ASIC cost divide into non-recurring engineering (NRE) expenses and per-unit manufacturing costs. NRE includes design, verification, mask tooling, and initial testing development. Unit costs comprise wafer fabrication, assembly, final test, and qualification, with cost structure varying significantly based on process technology and volume.

What factors influence ASIC development feasibility?

Key feasibility factors include projected volume requirements, technology selection, performance differentiation needs, available development timeline, and technical complexity. Projects requiring unique functionality combinations, specific power/performance optimization, or integration of proprietary algorithms typically show stronger feasibility than cost-reduction focused initiatives.

What are common go/no-go criteria for ASIC projects?

Decision criteria typically include volume projections supporting NRE amortization, clear performance or integration advantages over standard products, acceptable development timeline fitting market windows, and availability of required design resources. Technical feasibility assessment and competitive differentiation potential also influence project approval decisions.