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Semiconductors and sensors from Bosch
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Semiconductors & Sensors for Robotics

Semiconductor and sensor solutions engineered for intelligent, reliable, and scalable robotic systems.

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What drives the industry?

The robotics industry is moving from innovation labs to large-scale deployment. As robots increasingly operate alongside humans and in dynamic environments, developers face growing demands for perception, motion control, connectivity, safety, energy efficiency, and scalability. Sensor technologies have become a critical foundation for enabling intelligent, autonomous, and connected robotic systems.

How Bosch supports the robotics industry?

Bosch combines leading MEMS technologies with decades of semiconductor expertise, automotive experience, and application know-how. Together with Bosch Sensortec's consumer-grade sensing portfolio and Bosch Semiconductors’ automotive-grade sensing solutions, Bosch helps robotics customers move from emerging concepts to reliable, scalable deployment while benefiting from proven quality, manufacturing excellence, and long-term supply capabilities.

Robotics

Robotics Applications

Perception & Navigation

Robots must continuously understand their surroundings to navigate safely and operate autonomously. Bosch technologies support environmental perception, localization, navigation, mapping, object recognition, and obstacle avoidance through sensing, communication, and processing capabilities.

Motion Control & Balancing

Precise motion control is essential for mobile, humanoid, and industrial robots. Bosch’s semiconductor and sensor technologies enable orientation tracking, stabilization, balance control, velocity measurement, acceleration sensing, and safe movement in dynamic environments.

Environmental Awareness

To interact intelligently with the real world, robots need awareness of surrounding conditions. Bosch technologies support environmental monitoring, pressure sensing, air-quality analysis, environmental context detection, and intelligent adaptation to changing environments.

Connectivity & Control

Modern robotic systems rely on robust communication, control, and system integration. Bosch’s integrated circuits support networking, communication, power management, control architectures, and efficient interaction between distributed robotic subsystems.

Manipulation & Human Interaction

Human-centric robots require the ability to interact safely with people and objects. Bosch technologies enable tactile sensing, object manipulation, force and grip control, collision detection, teleoperation, and human-guided interaction.

Predictive Maintenance & System Health

Reliable operation depends on early detection of anomalies and wear. Bosch’s sensing technologies enable vibration monitoring, condition monitoring, predictive maintenance, and self-monitoring capabilities that help maximize uptime and operational efficiency.

Recommended Products: automotive-grade sensors​

Bosch’s broad product portfolio delivers a unique advantage to the segment by combining the best of two worlds: the functional safety and long-term availability of our automotive-proven sensors, with the wide selection and rapid innovation cycles from our consumer-proven sensors.

Looking for more products? Explore our complete portfolio of automotive-grade MEMS sensors.

Product​
Dimension ​(mm²)​
Key Features​
Product​
SMI330 ​
Dimension ​(mm²)​
LGA 3 x 2.5
Key Features​
  • Axes: yaw / pitch / roll rate and acceleration x/y/z ​
    (6 degrees of freedom)​
  • Measurement range: ±125 or ±250 or ±500 or ±1000 or ±2000 °/s (Ω)​
    ±2 or ±4 or ±8 or ±16g (a)​
  • Data resolution: 16 bits​
  • Sensitivity: Ω: 4 % (typ), A: 0.5% (typ)​
  • Operating temperature: -40°C to +125°C​
Product​ Dimension ​(mm²)​
CLCC 8 x 8​
Key Features​
  • Axes: yaw / pitch / roll rate and acceleration x/y/z (6 degrees of freedom)​
  • Measurement range: 300 dps | low-g: 8 g | Mid-g: 30/35 g​
  • Total offset: 0.15 dps / 20 mg​
  • Sensitivity: 0.5 %​
  • Operating temperature: -40°C to +125°C​
  • Functional safety: ASIL D​
Product​ Dimension ​(mm²)​
LGA 8 x 8
Key Features​
  • Axes: yaw / pitch / roll rate and acceleration x/y/z ​
    (6 degrees of freedom)​
  • Measurement range: 300 dps | low-g: 6/8 g​
  • Data resolution: 16/20 bits​
  • Sensitivity: 1%​
  • Operating temperature: -40°C to +125°C​
  • Functional safety: ASIL D​
Note: The final product selection depends on the specific requirements of your application and end product.
Product​
Dimension ​(mm²)​
Key Features​
Product​
SMP290 ​
Dimension ​(mm²)​
DFN 4.5 x 3.5​
Key Features​
  • Integrated SoC solution​
  • Configurable BLE communication (Interface: BLE V5.4)​
  • Measurement range: ​
    • 90 kPa …920 kPa (90 kPa …1,500 kPa for CV)​
    • ax -110 g …110 g (-330 g …330 g)​
    • az -320 g …320 g (-960 g …960 g)​
  • Cyber Security according to ISO21434​​
  • ​Software development ASPICE Level 2​
  • Operating temperature: -40 °C …125 °C​
Note: The final product selection depends on the specific requirements of your application and end product.
Product​
Dimension ​(mm²)​
Key Features​
Product​ Dimension ​(mm²)​
LGA 2.3 x 2.8
Key Features​
  • Up to 10kHz vibration sensing
  • Measurement range: ±16/32 g (ax, ay, az)​​
  • Interface: SPI​​
  • Output data width: 16 bit​
  • Output data rate: 24/48 kHz​
  • Supply voltage: 1.7 V – 3.6 V​
  • Operating temperature: -40°C to 125°C​
Note: The final product selection depends on the specific requirements of your application and end product.

Recommended Products: consumer-grade sensors​

Looking for more products? Explore our complete portfolio of consumer-grade MEMS-sensors.

Product​
Dimension ​(mm)​
Key Features​
Product​
BMI563​
High-performance IMU​
Dimension ​(mm)​
2.5 x 3.0 x 0.75​
Key Features​
  • Measurement range: ±32 g (Acc), ±4.000 ∘/s (Gyro)
  • ​Noise (low): 50µg/√Hz & < 3 mdps/√Hz)​
  • Vibration robustness from 0 to 40 kHz up to MHz range​
  • Power consumption: 650 µA for typ. operation (A+G combo @ max. ODR)​
  • Integrated advanced features (programmable Edge-AI classification engine, sensor fusion)​
  • Interface: MIPI I³C®, I²C, SPI​
Product​
BMI423​
Standard IMU​
Dimension ​(mm)​
2.5 x 3.0 x 0.83​
Key Features​
  • Measurement range: ±32 g (Acc), ±4.000 ∘/s (Gyro)​
  • Noise: 90 µg/√Hz & 5.5 mdps/√Hz ​
  • Power consumption: 575 µA (A+G combo, high-performance mode)​
  • Integrated feature set for activity tracking, head movement and UI applications​
  • Interface: MIPI I³C®, I²C, SPI​
Product​
BMI088​
High-performance IMU​
Dimension ​(mm)​
3.0 x 4.5 x 0.95
Key Features​
  • Measurement range: ±24 g (Acc), ±2000∘/s (Gyro)​
  • Noise: 175 μg/√Hz ​& 14 mdps/√Hz​
  • Vibration robustness (closed-loop gyroscope)​
  • Power consumption: 5.15 mA (full operation)​
  • Interface: I²C, SPI​
Product​
BHI360​
Smart sensor​
Dimension ​(mm)​
2.5 x 3.0 x 0.95​
Key Features​
  • Measurement range: ±16 g (Acc), ±2000∘/s (Gyro)​
  • Noise: 160µg/Hz & 7 mdps/√Hz​
  • 32-bit MCU, up to 50MHz, Floating Point Unit, 256kB SRAM ​
  • Dedicated low power MCU for always-on algorithms​
  • Open programmable platform and integrated sensor fusion software​
  • Interface: I²C, SPI​
Note: The final product selection depends on the specific requirements of your application and end product.
Product​
Dimension ​(mm)​
Key Features​
Product​
BME690 ​
Gas sensor​
Dimension ​(mm)​
3.0 x 3.0 x 0.93​​
Key Features​
  • Low power consumption​
  • Fast response time​
  • Specific gas sensing​​
  • Interface: I²C (up to 3.4 MHz) and SPI (3 and 4 wire, up to 10 MHz)​
Product​
BMV080​
Particulate matter sensor​
Dimension ​(mm)​
4.4 x 3.0 x 3.0
Key Features​
  • Fanless design for non-disturbing operation​
  • Precise PM measurement ​
  • Ultra-compact form factor​
  • Interface: SPI, I²C​
Note: The final product selection depends on the specific requirements of your application and end product.
Product​
Dimension ​(mm)​
Key Features​
Product​
BMP585 ​
Gel-filled​ pressure sensor​
Dimension ​(mm)​
3.25 x 3.25 x 1.86​​​
Key Features​
  • Excellent temperature stability​​
  • High robustness and reliability​
  • Operating range (full accuracy): Pressure: 300 … 1250 hPa​​
  • Noise in pressure (typ.),highest resolution: 0.08 PaRMS​
  • ​Average typical power consumption: 1.3 µA @ 1 Hz pressure and temperature, 0.55 µA in deep standby mode
  • Interface: MIPI I³C®, I²C, SPI​
Product​
BMP581 ​
Pressure sensor​
Dimension ​(mm)​
2.0 x 2.0 x 0.75​
Key Features​
  • Centimeter-level accuracy in height​​
  • Operating range (full accuracy): Pressure: 300 … 1250 hPa​ ​
  • Noise in pressure (typ.), lowest bandwith/ highest resolution: 0.08 Pa​
  • Average typical power consumption: 1.3 µA @ 1 Hz pressure and temperature, 0.5 µA in deep standby mode​
  • Interface: I²C (up to 1.0 MHz), I3C, and SPI (3 and 4 wire, up to 10 MHz)​
Note: The final product selection depends on the specific requirements of your application and end product.
Product​
Dimension ​(mm)​
Key Features​
Product​
BMM350 ​
Magnetometer​
Dimension ​(mm)​
1.28 x 1.28 x 0.5​​​​
Key Features​
  • Unique field shock recovery feature​
  • Magnetic field range, all axes: ± 2000 µT​​
  • High accuracy and ultra-low noise due to TMR technology​
  • Average typ. power consumption (very low): 200 µA @ 100 Hz in normal mode​​
  • ​Interface: MIPI I³C®, I²C​
Note: The final product selection depends on the specific requirements of your application and end product.

Why Bosch for Robotics?

Semiconductor expertise meets robotics innovation

Bosch combines more than 60 years of semiconductor expertise with decades of MEMS development, electronics, software, and system experience.

From components to application know-how

Bosch supports customers beyond individual components with expertise in sensing, motion control, connectivity, software, and complex system architectures.

Built on proven automotive standards

Automotive experience contributes to reliability, functional safety, security, diagnostics, and dependable operation for demanding robotics applications.

Manufacturing excellence and scalability

Bosch combines global manufacturing capabilities, supply-chain resilience, and high-volume production expertise to help robotics scale beyond prototypes.

Enabling the next generation of robotic systems

Bosch technologies support intelligent perception, motion control, interaction, connectivity, and automation across a wide range of robotic platforms.