Semiconductor solutions engineered for efficient, reliable, and scalable AI data center power architectures.
What drives the industry?
The rapid growth of AI computing is transforming data center power infrastructure. Rising computing performance is driving higher power requirements, greater power density, and increasingly complex power conversion architectures. As the industry moves toward higher voltages and new power distribution concepts, efficient and reliable semiconductor technologies are becoming critical enablers for next-generation AI infrastructure.
How Bosch supports the AI data center industry?
Bosch combines leading MEMS technologies with decades of semiconductor expertise, automotive experience, and application know-how. Together with Bosch Sensortec's consumer-grade sensing portfolio and Bosch Semiconductors’ automotive-grade sensing solutions, Bosch helps robotics customers move from emerging concepts to reliable, scalable deployment while benefiting from proven quality, manufacturing excellence, and long-term supply capabilities.
As AI data centers require increasing amounts of power, architectures are evolving toward higher voltages, including 800 V DC distribution. Efficient high-voltage power conversion can help transport and distribute increasing power levels while reducing conversion losses.
Growing AI workloads are driving data center power supplies toward higher output levels and increasing power density. SiC technology enables efficient power conversion at high voltages and switching frequencies, supporting more compact and efficient power electronics.
Next-generation data center architectures require efficient conversion between different voltage levels throughout the power path from the grid to the GPU. Bosch's experience with high-voltage conversion and SiC switching technologies provides a foundation for these demanding power conversion requirements.
Future solid-state transformer concepts could move power electronics closer to medium-voltage grid levels, further increasing the relevance of high-voltage SiC technology for efficient power conversion in next-generation data center architectures.
Bosch transfers decades of experience in automotive power electronics to AI data center applications, building on technologies proven in demanding high-voltage environments.
Bosch's SiC technology is developed for demanding automotive requirements and backed by extensive quality and field experience, providing a proven foundation for large-scale data center infrastructure.
Bosch develops SiC technology for a balanced combination of efficiency, switching performance, high-voltage capability, and robustness across demanding power electronics applications.
High-volume automotive manufacturing experience and the transition to 200 mm wafer production provide a scalable foundation to support growing SiC demand and larger customer volumes.
Bosch's dual-fab setup in Reutlingen and Roseville strengthens supply resilience through geographically diversified SiC production and supports customers seeking a local manufacturing footprint in key markets.
Discover insights, technologies, and expertise around silicon carbide and advanced power electronics.