CES Las Vegas – the first big event of 2026

Discover the latest generations of our robust dual-channel SiC trench MOSFETs for 1,200 V and 750 V: They deliver high efficiency, power density, and reliability for electric vehicles. Did you know that our SiC technology also forms the basis of our scalable, highly efficient power modules? Drop by our booth at CES 2026 and find out how they enable compact, yet robust traction inverters for electric and hybrid vehicles.

Our MEMS sensor solutions are as versatile as their applications – from tire pressure monitoring, safety and ADAS, to noise cancellation. And they have all been developed with the requirements of future mobility in mind. Take for instance Bosch’s SMP290 tire pressure sensor with integrated Bluetooth Low Energy (BLE) interface, which enables new integration concepts as well as smartphone interaction.

Another MEMS innovation you will find in our Tech Room is the new SMA380 single-channel high-bandwidth acceleration sensor with TDM and I2C interface for road noise cancellation. It enhances driving comfort by detecting and processing vibrations from road noise with low latency.

Our latest high-performance inertial sensor, the SMU300, provides precise localization for autonomous driving, featuring low noise, “close-to-zero” temperature drifts, and ceramic packaging.

Don’t miss out on our integrated circuits for automotive applications. The new Bosch system-on-chip (SoC) product family combines the most important components for radar SoCs. They offer an exceptionally high resolution and long range even for small objects. The high computing power of the SX601 additionally supports machine-learning applications for advanced object recognition.

For even greater sensor performance, Bosch is also turning to raw data with the new ultrasonic sensor IC chipset TB293/TB193: here, the signal is being recorded directly at the transducer, so that the full range of data is being retained. This is a great advantage, especially for AI-based functions. As a result, the sensors allow much better object detection. The TB293 and TB193 chips for ultrasonic sensors are freely available on the market. With this step, Bosch is also making its new VASI (versatile automotive sensor interface) bus interface available, thus setting a new standard. This means that automakers can choose their sensor supplier more flexibly, benefit from state-of-the-art ultrasonic technology, and avoid lock-in effects.

Our CAN SIC XL transceiver has been designed to meet the growing bandwidth demands of future vehicle platforms in modern E/E architectures. It enables data rates of up to 20 Mbit/s and allows for the integration of IP-based protocols alongside classic CAN communication. As a key driver of CAN technology, Bosch is continuing to advance development of CAN networks toward increased performance and flexibility.