ps_share_on Bosch’s global SiC semiconductor manufacturing network The winning team to secure the semiconductor supply chain Discover our SiC portfolio Silicon carbide (SiC) semiconductor manufacturing is a complex task, especially regarding material characteristics and quality requirements. This calls for profound technical know-how, innovative processes, and a well-coordinated team of experts. Bosch is committed to delivering its customers the highest quality “invented for life”. This, of course, also applies to our SiC semiconductors. To make sure that every single chip is delivered in the same high quality all over the world, we rely on a comprehensive network of research and manufacturing facilities, test centers, and partners – which we are continuously expanding. Let’s take a closer look. Advantages and challenges of a global network With the fab in Roseville, California, Bosch will systematically reinforce its global portfolio of SiC chips. Bosch’s global SiC semiconductor manufacturing network currently comprises one wafer fab in Reutlingen (Germany) and one in Roseville, California (USA), which is currently being overhauled for the planned production start of SiC chips in 2026. The fabs are complemented by test centers as well as specialized external partners. This puts us in an optimal position to ensure semiconductor supply chain resilience and production capacities, especially in challenging times. Our customers further benefit from local proximity and expertise. Our geographic and strategic focus enables us to improve the global availability of semiconductors for automotive applications, drive innovation, and provide faster and more reliable solutions to local markets Needless to say, a global strategy also comes with some specific challenges. The more complex the network, the more important it is to streamline processes. Sending semiconductors around the world requires robust logistics. But above all, an equal level of quality and expertise must be ensured across the globe. Production and testing must be performed at the same high-quality standards at all locations. SiC semiconductor manufacturing is a good example of how we do just that even if there are additional challenges like ensuring uniform material characteristics. Substrate quality and availability Even before the chips are produced, Bosch works closely with numerous suppliers. For instance, we are continuously expanding our portfolio of SiC substrate suppliers. The substrate is the foundation of any SiC semiconductor device. This raw material has a considerable influence on the chip yield and overall costs. To ensure uninterrupted substrate supply and to strengthen the global availability of SiC semiconductors, Bosch has established a diversified supplier portfolio. Following a multi-sourcing and multi-location strategy, we have established long-term supply contracts with various partners from different regions for 200 mm substrates. Our experts make sure that the quality is the same no matter where the substrate comes from, for instance by using dedicated metrology tools with specific software to analyze the defect density of substrates. Innovative manufacturing processes When it comes to manufacturing, Bosch has set and is continuing to set new standards with its highly innovative trench etch process, also known as the Bosch process. As one of the first and few providers worldwide, Bosch built on this process – initially designed for micro-electromechanical systems (MEMS) – to create vertically trenched SiC semiconductors. The patented process for 150 mm SiC wafers has now been developed further for the deep trench etching of 200 mm wafers. Bosch has been producing samples of the first generation 2 SiC chips on 200 mm wafers in Reutlingen since June 2024 for customer trials and is currently preparing to ramp up series production of generation 2 on 200 mm in Reutlingen. This process is currently applied in Reutlingen, where Bosch has already been producing 150 mm SiC chips since 2021. They will be discontinued in 2026 in favor of ramping up the production on 200 mm wafers. These chips are already available for customer trials since June 2024 and ramp-up for series production is being prepared. In parallel, the new U.S. facility in Roseville is being transformed for SiC 200 mm production. Ensuring knowledge exchange The success of Bosch’s global semiconductor manufacturing network depends on the continuous exchange of knowledge and experience. To make the technology exchange from Reutlingen to Roseville as smooth as possible, we established an international buddy system. Engineers from Roseville were paired with experts from Reutlingen to learn everything they need to know about the production of SiC chips – and to be ready when the first generation 2 SiC chips on 200 mm wafers are produced in Roseville. Bosch plans to manufacture the first chips in Roseville for customer trials in 2026, and to prepare the ramp-up of series production. Once produced, the chips undergo comprehensive testing to ensure their performance, reliability, and compliance with the demanding automotive standards. Set for further SiC portfolio expansion Bosch offers a comprehensive portfolio of SiC semiconductors – from bare dies to discretes and power modules Since the development of the first SiC chips in 2001, the scope of SiC semiconductors from Bosch has never stopped growing. During the past years, Bosch has expanded its presence in the external market and is now also operating as an independent supplier: SiC MOSFETs are sold directly to OEMs, Tier 1 and Tier 2 suppliers, as well as to distributors in the form of bare dies, discretes, and power modules. Thanks to many years of vertical integration – from modules to inverters to the eAxle – Bosch has the deep manufacturing expertise to optimally support its customers. This makes Bosch one of the few manufacturers in the world to be so flexibly positioned in the field of SiC. With our strong global SiC semiconductor manufacturing network, we have established the ideal team to secure the semiconductor supply chain and will continue to drive innovations in SiC semiconductor manufacturing. 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