Countdown to IAA MOBILITY 2025

IAA MOBILITY 2025 is just around the corner! From September 9 to 12, Bosch will be exhibiting in Munich, hall B3.D01. As one of the world’s leading events for the mobility industry, the trade show offers the perfect platform to explore how semiconductors and sensors are driving the transformation of automotive systems. From energy-efficient silicon carbide (SiC) power modules to high-precision environmental sensing – we will showcase technologies that enable connected, automated, and electrified mobility. For everyone who can’t wait, we have put together a selection of highlights from our booth:

Powering the future with silicon carbide

Discover our latest SiC power semiconductor portfolio at IAA MOBILITY. These components offer OEMs, Tiers, and distributors scalable options for various power electronics applications. For example, our dual-channel SiC trench MOSFETs in 750 V and 1,200 V are available as bare dies for inverter modules or in package for on-board chargers, DC/DC converters, and traction inverters. Our experts will be happy to explain how our SiC technology helps increase system efficiency and reduce energy losses – especially in electromobility.

Faster data transmission in next-generation vehicle networks

Discover the CAN SIC XL Transceiver: Powering Next-Gen E/E Architectures. Unlock data rates up to 20 Mbit/s, seamlessly integrating IP-based protocols with classic CAN communication. See how this transceiver delivers stable, scalable, and cost-effective networking to meet the growing bandwidth demands of future vehicle platforms.

CAN SIC XL Transceiver NT156 for the network requirements of tomorrow's vehicles

Advancing driver assistance with high-performance radar sensors

Gain deeper insights into the new Bosch radar system-on-chips (SoCs) at our booth. These SoCs combine key radar functionalities into a single component, reducing system complexity and costs. Thanks to advanced semiconductor design, they offer up to 30 percent more range, with the SX601 having the highest total computing capabilities in the market. Drop by our booth and find out exactly how these sensors enhance object detection and support next-generation advanced driver assistance systems (ADAS) functions.

Radar SoC family SX601/SX600 for driver assistance

Setting new standards in tire pressure monitoring

IAA MOBILITY will also be the ideal place to see Bosch’s new SMP290 tire pressure sensor, designed to improve both safety and vehicle architecture. Featuring ultra-low power consumption, compact design, and Bluetooth connectivity, the sensor enables new integration concepts and smartphone interaction. The SMP290 has been recognized as “Best Automotive & Mobility Solution” at the 2025 Best of Sensors Awards. Are you curious to know how its design supports simplified system integration and enables new digital services? Then make sure to stop by our booth and talk with our experts.

SMP290 - Tire pressure sensor module with integrated Bluetooth Low Energy interface

MEMS inertial sensors for centralized vehicle architectures

Another highlight of our booth at IAA MOBILITY: Bosch’s latest high-performance MEMS inertial sensors, including the SMU300 and SMI980. They provide highly accurate data for multiple systems, from ESP to localization and ADAS. The sensors are especially designed to support centralized vehicle architectures. Following a “one sensor for all” philosophy, they help reduce complexity in software-defined vehicles. Talk to our team to find out how these components can streamline system design and enable advanced vehicle functions.