Bridging semiconductor innovation and customer applications

As a Senior Application Engineer at Bosch, I specialize in power semiconductors and discrete devices. My focus is on non‑traction inverter applications, such as on‑board chargers. Through direct interaction with customers, I identify requirements, support the selection of the optimal products, and act as a coordinator between customers, application engineering, and development teams. This is how I help align product strategies and technology roadmaps with market needs.

Over the past few years, the importance of silicon carbide (SiC) has increased significantly. This technology enables compact and highly efficient power electronics, opening up new possibilities across a wide range of applications. Beyond the automotive sector, demand is growing rapidly in industrial and energy-related applications as well.

At the same time, new packaging and cooling concepts are emerging, enabling even better integration of semiconductor devices into overall system architectures. Our growing expertise in SiC MOSFET technology, combined with comprehensive application know-how, also enables increasingly tailored customer solutions. Simultanously, innovation cycles have become considerably shorter, allowing new technologies to reach the market much faster than before.

A key part of my job is to identify the optimal solution from our product portfolio for a specific application together with customers and colleagues around the world. This involves analyzing technical requirements, evaluating potential synergies and trade-offs, and providing clear recommendations.

At the same time, these insights contribute directly to the ongoing development of our portfolio and help shape future technology and product roadmaps.

A strong technical background and extensive experience in power electronics are fundamental for this position. A broad understanding of different applications and their specific requirements for semiconductor devices is equally important.

As technologies and markets continue to evolve, flexibility, openness to new topics, and a willingness to keep learning are essential. My role also requires close collaboration across multiple disciplines, ranging from semiconductor physics and packaging concepts to thermal management, system design, and application engineering.

What makes my role special is that I have had the opportunity to witness the development and adoption of SiC technology from the very beginning. Today, I actively help shaping Bosch’s strategy in this field .

I am particularly motivated by the opportunity to explore new applications and bring innovative technologies to market. Direct interaction with customers constantly provides new perspectives and helps me gain a deeper understanding of their challenges and requirements.

At the same time, I highly value the international nature of my job. From the location in Germany, I collaborate daily with colleagues and customers across Asia, Europe, and the Americas, allowing me to contribute to and learn from global developments firsthand.

Customers benefit from my ability to combine in‑depth knowledge of our semiconductor products with a strong understanding of their specific applications. Through close collaboration, I gain early insight into their requirements and challenges, which allows me to support them in selecting the technically and economically optimal solution.

I accompany projects throughout the entire development process: from the initial evaluation and product selection to implementation in the final application. Thanks to our extensive semiconductor and application expertise, we can resolve technical questions quickly, address challenges early, and support the development processes efficiently. This helps increase development confidence, shorten time‑to‑market, and contribute to the long‑term success of customer projects.

My work is currently shaped by the growing adoption of new power electronics applications, each with different requirements regarding switching frequency, voltage levels, and operating conditions. As a result, there is an increasin focus on optimizing semiconductor technologies and device characteristics for specific applications.

At the same time, SiC technology enables higher power levels and greater power density. This is driving the development of innovative packaging and cooling concepts, particularly top‑side cooling solutions.

I work closely with customers as well as colleagues from a wide range of disciplines, relying on open and continuous communication. This allows us to identify potential challenges and optimization opportunities early and address them proactively.

This collaboration is not only essential for finding the best technical solution for current projects, it also provides valuable input for our product portfolio’s further development. Insights gained from today’s projects have a direct impact on future products and technology roadmaps.

For me, transparency, reliability, and long‑term thinking are the foundation of successful collaboration. It is important to create realistic expectations and consistently deliver on our commitments.

Personal interaction is equally important to me. Open communication builds trust and lays the foundation for sustainable, long‑term success.