Name: CAR-ELE 2026
Start: 2026-01-21T08:00:00
End: 2026-01-23T05:00:00
Location: Tokyo, Japan

21 - 01/23/2026

Tokyo, Japan

Driving innovation: Bosch at CAR-ELE 2026

By combining expertise in semiconductors and sensors, Bosch is shaping intelligent mobility solutions for the vehicles of the future. As an independent semiconductor provider, we deliver cutting-edge technology that drives innovation across the automotive industry.

Discover our latest technology highlights at CAR-ELE 2026, the world’s leading exhibition for automotive electronics.

Explore our latest portfolio innovations

SiC Power Semiconductors: Explore the newest generations of our dual-channel SiC trench MOSFETs for 1,200 V and 750 V, along with highly efficient power modules built on Bosch’s proprietary SiC technology.
Wide-Bandgap Innovations: Get an exclusive look at our advanced SiC trench architecture, engineered to meet the rigorous demands of automotive applications.
Latest MEMS Sensor Solutions: Covering tire pressure monitoring, safety, ADAS, comfort, vibration monitoring, and road noise cancellation.
Radar SoC Family & Ultrasonic Sensor IC Chipset: High-performance microelectronics enabling assisted and automated driving.
CAN SIC XL Transceiver: Designed to support the networking needs of tomorrow’s vehicles.
Optimized Switching Control & Built-In Protection: Discover Bosch’s automotive gate driver IC EG120, delivering precise control and integrated safety features for SiC MOSFET systems.
Automotive Chiplet System: Developed in collaboration with partners as part of the EU-funded CHASSIS project.