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博世半导体

CES 2026

Convention Center – Central Hall | Booth 16203

06 - 01/09/2026
Las Vegas, Nevada
CES 2026

Experience semiconductor innovations from Bosch at CES 2026

Bosch is shaping the future of mobility with cutting-edge semiconductor and sensor technologies. At CES 2026, we invite you to explore our latest advancements in automotive electronics.

What’s new in our portfolio?

  • SiC power semiconductors: Discover the latest generations of our dual-channel SiC trench MOSFETs for 1,200 V and 750 V, along with highly efficient power modules based on Bosch’s proprietary SiC technology.
  • Wide-bandgap innovations: Get a first look at our advanced SiC trench architecture, specifically designed to meet the demanding requirements of automotive applications.

Explore the Bosch Tech Room

Dive deeper into our technology highlights:

  • Latest MEMS sensor innovations for tire pressure monitoring systems, safety, ADAS and road noise cancellation
  • Radar SoC family and ultrasonic sensor IC chipset - powerful microelectronics for assisted and automated driving
  • CAN SIC XL transceiver for the network requirements of tomorrow’s vehicles
  • Automotive Chiplet Technology – redefining vehicle computing for enhanced performance and safety

Let’s meet at CES

Are you interested in one or more of these topics? Book your exclusive meeting slot with our experts and receive a discount code for your CES registration.

Can’t make it to Las Vegas?

No problem – drop us a message and we’ll get in touch with you directly.

We’re looking forward to kicking off the new year with you at CES!