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Bosch offers different bond techniques to bond wafers and seal the enclosed space hermetically.

Eutectic Bonding
Eutectic Bonding

Available Wafer Bonding Technologies @ Bosch in series production:

  • Anodic Bonding
  • Eutectic Bonding (AlGe)
  • Glass Frit Bonding

In pre-development*:

  • Thermocompression Bonding
  • Direct Bonding

In-Line Characterization methods for bonded wafer stacks:

  • (IR-)Microscopy
  • Scanning Acoustic Microscopy (SAM)

Bonding capabilities
Bonding capabilities