Metals, Liners, Anorganic BARCs
Metals, Liners, Anorganic BARCs
Bosch offers a variety of state of the art backend and frontend processes
Sputtering: Al, AlCu, Ti, TiN, Co, (transformation to CoSix available), WSix, Ni, NiFe, Au, Pd, Ag, TiW, Pt, Ta, TaN, Cu (dual damascene capability), Si
CVD: W
MoCVD: TiN
Backside sputtering: AlCu, Cr, NiVx, Au, Ag
ENEPIG Ni, Pd, Au (electroless), for example as OPM
Electroplating: Cu
More specific materials
Classical dry etch or IBE for all above
Ion Beam Etching
- Etching for up to 4µm thick layers
- Some material expamples: NiFe, Au, Ag, Pt, PZT, KNN, TaN, TiN, LNO
Multi Source Sputtering
Special tool for foundry topics
Additionally to the full production sputter processes, we can offer a multisource chamber.
Capability of co- and multilayer-sputtering with 4 x 100 mm targets (we can deposit almost „everything“)
- Low deposition rate but capability of controlled deposition of ultra thin layers <1nm
- Mainframe:
- 4 single source sputter modules: Ti, Ag, Al/AlOx (reactive), AlCu
- Peripheral modules: softetch; cooler; degas
- Attached to mainframe :1 multi source sputter module
- 2 x RF- and 2 x DC- sources
- Ar + N2 +O2
- Tw,max > 500°C
- Rotating chuck
- Wafer shutter and source shutter
Currently available targets:
- Ag, Al, Al2O3, Au, Cr, Cu, Ge, Mo, NiCr, Ru, Si, Ti, W