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Bosch semiconductors for Automotive

BT2M120 Bare Die

1,200 V SiC (Generation 2) bare die MOSFETs for inverter modules

Application & Technical Summary

BT2M120

The BT2M120 family of silicon carbide switches handles voltages up to 1,200 V. The bare die versions are designed for high power applications like inverter modules with system voltages around 800 V.

The robust MOSFETs reduce conduction and switching losses and allow for higher switching frequencies.

For applications such as applications like on-board chargers, DC/DC converters and inverters in (hybrid) electric vehicles, also packaged versions are available.

Product benefits

  • Bosch dual channel trench gate technology for lower RDS(on) × A
  • Switching speed adjustable with gate resistors
  • Front side metallization option for sintering and soldering
  • Qualification: Based on AEC-Q101 & SiC specific validation

Efficient and robust

power switches for inverter modules

Technical Features

BT2M12000090BOA BT2M1200010BOA BT2M1200013BOA
RDS(on) @ 50% IDS max
BT2M12000090BOA
9 mΩ
BT2M1200010BOA
11 mΩ
BT2M1200013BOA
13 mΩ
VDS
BT2M12000090BOA
1.200 V
BT2M1200010BOA
1.200 V
BT2M1200013BOA
1,200 V
ID max
BT2M12000090BOA
175 A
BT2M1200010BOA
140 A
BT2M1200013BOA
125 A
Package
BT2M12000090BOA
bare die
BT2M1200010BOA
bare die
BT2M1200013BOA
bare die
Type
Silicon carbide trench MOS
Front side metallization
  • BOA type: AlCu/Ni/Pd/Au (flash)
Drive voltage
-5 V ... 15 V or 18 V
Miller ratio (QGD/QGS)
<1
Features
  • Wafer thickness: 180 µm
  • High oxide reliability
Tj min [°C]
-40 °C
Tj max [°C]
175 °C (200 °C for t < 100 h)

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